Test methods
Test and program PCBs and assemblies at component and functional level.
At board level, contacting determines test quality. The bed of nails, fixture and signal routing must match the layout, establish reproducible contact and remain stable over many thousands of cycles.
Depending on the task, MCF combines in-circuit testing, functional testing, boundary scan and flash programming in one sequence. The result is more than pass or fail: it identifies the affected net, component or function.
The testability of an assembly is determined during layout. We therefore assess test points, accessibility, the JTAG chain and BSDL models at an early stage and define which portion is covered by probes and which by boundary scan. For highly integrated boards with little free space, this is often the only way to achieve reliable test coverage.
Classification
This test method is used in several phases, each with different requirements for system design, automation and documentation.
Whether as a stand-alone test station or part of an integrated concept spanning several lifecycle phases, MCF configures the method for your device, volumes and process environment – including contacting, measurement technology, test software and documentation.